This a term for solder which becomes liquid and solid at the
same temperature. How is this possible?
An explanation is given by Wikipedia:
" … each pure component [of a homogeneous
mix of materials] has its own distinct bulk lattice arrangement. It is
only in this atomic/molecular ratio that the eutectic system melts as
a whole, at a specific temperature (the eutectic temperature) the
super-lattice releasing at once all its components into a liquid
mixture. The eutectic temperature is the lowest possible melting temperature
over all the [possible] mixing ratios for the involved component species.
Upon
heating any other mixture ratio, and reaching the eutectic temperature, … one
component's lattice will melt first, while the temperature of the mixture has
to further increase for (all) the other component lattice(s) to melt.
Conversely, as a non-eutectic mixture cools down, each mixture's component will
solidify (form its lattice) at a distinct temperature, until all material is
solid."
[https://en.wikipedia.org/wiki/Eutectic_system]
When soldering with 63/37 solder, the solder is heated above
its melting (liquidus) point and so remains liquid for a short time until is reaches
its solidification temperature. The
important element is that this is the lowest temperature that a mixture of materials
can melt. In the case of lead/tin
solder, it 183C. Other solders have different
eutectic temperatures, e.g., a 96.3% tin and 3.7% silver solder has an eutectic
point of 221C.
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