Using Glass for Passivation in Semiconductor Applications

 

Robotic arm holding a silicon wafer for semiconductor processing. Image source: iStock.

A blog post by Krista Grayson of Mo-Sci rayson

In the fast-paced world of semiconductor manufacturing, where precision and reliability are paramount, choosing a suitable passivation material is critical to ensuring the optimal performance of electronic devices. Among the library of viable materials, glass has gained significant attention for its unique properties and versatility. This article looks at how glass is used for passivation and what properties make it highly suitable for the job.

Understanding Passivation in Semiconductors

Before unpacking the specifics of glass as a material for passivation, it is essential to understand the concept of passivation in semiconductor manufacturing. Passivation involves depositing a protective material onto the surface of metals or metal alloys to enhance their resistance to environmental factors.

The layering material can be organic or inorganic and should exhibit excellent electrical insulation and strong substrate adhesion, as well as block the ingress of chemical species. In the case of semiconductors, passivation is crucial to preventing degradation and ensuring long-term reliability.^1,2

Why Use Glass for Passivation?

Glass has emerged as a compelling choice for passivation due to its unique combination of properties. For example, glass can be formulated in numerous ways, with common types including Pb-Si-Al, Zn-B-Si, and Pb-Zn-B. This allows manufacturers to produce glass capable of meeting low and high-voltage electrical specifications; matching the coefficient of thermal expansion of semiconductor materials; and meeting the low temperature processing requirements.^3,4

Glass is chemically durable and thus can provide an inert barrier against external elements, such as moisture and contaminants, which might otherwise compromise the semiconductor’s performance. Moreover, the high transparency of some glasses, such as borosilicate glass, makes them ideal for applications with critical optical properties, such as photovoltaics. This transparency enables efficient energy transmission and absorption, contributing to the overall performance of semiconductor devices and solar cells.^5,6

How are Semiconductors Passivated?

Glass can be deposited onto semiconductors in a variety of ways. Choosing methods for passivation depends on factors such as the semiconductor device’s specific requirements, the passivation layer’s desired properties, and the overall manufacturing process. Methods for achieving glass passivation in semiconductor manufacturing include:⁷

• Chemical vapor deposition (CVD), including plasma-enhanced CVD (PECVD)
• Physical vapor deposition (PVD), including E-beam deposition
• Sputter Coating
• Atomic Layer Deposition (ALD)

In manufacturing, the process of glass passivation is frequently succeeded by chemical procedures, such as the etching of contact windows or the electrolytic deposition of contacts. These procedures may pose a threat to the integrity of the glass.

The chemical resistance of different passivation glasses varies significantly and serves as a crucial factor in determining the suitable glass type and the accompanying etching process.⁸

Comparing Glass to Other Materials

While various materials can be used for passivation, glass stands out for its exceptional stability over temperature, humidity, and time. Literature searches reveal a lack of head-to-head comparisons with other common passivation materials; however, general comparisons can be drawn.⁶

Amorphous silicon (a-Si) films utilized in solar cells present numerous advantages. These include a lower deposition temperature, in contrast to the temperatures commonly employed in cell manufacturing. However, it is essential to note that a-Si films exhibit sensitivity to subsequent high-temperature processes, which are frequently necessary in industrial manufacturing technology.⁹

Similarly, AlO_x passivation films can be applied at relatively low temperatures but can be limited by slow deposition speeds when using specific application methods. This can generate problems for high-throughput techniques, such as solar cell production.⁹

Polyimide, a common passivation material lauded for its strength and thermal stability, is also susceptible to moisture absorption. This can impact the strength and dielectric properties of the protective coating, risking the integrity of the semiconductor.¹⁰

Applications of Glass Passivation

Passivation glasses demonstrate outstanding performance in wafer passivation and encapsulation processes, providing advantages to a diverse range of semiconductor devices, including:⁸

• Thyristors
• Power transistors
• Diodes
• Rectifiers
• Varistors

Glass also has applications in solar cell passivation. In a recent study, researchers developed a method for enhancing borosilicate glass (BSG) passivation using high temperatures before lowering the temperature to accommodate the metallization process. In doing so, they notably improved the solar cell’s efficiency.¹¹

In another study, phosphosilicate glass (PSG) was found to significantly enhance the practical lifetime of minority carriers and improve the overall performance of solar cells, particularly in structures involving nanocrystalline silicon and crystalline silicon.¹²

Mo-Sci’s Expertise in Glass Thin Films

Fueled by the increasing prevalence of smart devices and advancements in the automotive and aerospace sectors, the semiconductor passivation glass market is anticipated to grow consistently in the next few years.³

Mo-Sci’s expertise lies in leveraging the unique properties of glass to create tailored solutions, ensuring the reliability and performance of many applications, including glass seals and glass coatings. Contact us for more information.

References and Further Reading

1. Pehkonen, S.O., et al. (2018). Chapter 2 – Self-Assembly Ultrathin Film Coatings for the Mitigation of Corrosion: General Considerations. Interface Science and Technology. doi.org/10.1016/B978-0-12-813584-6.00002-8
2. Lu, Q., et al. (2018). Chapter 5 – Polyimides for Electronic Applications. Advanced Polyimide Materials. doi.org/10.1016/B978-0-12-812640-0.00005-6
3. Reliable Business Insights. [Online] Semiconductor Passivation Glass Market – Global Outlook and Forecast 2023-2028. Available at: https://www.reliablebusinessinsights.com/purchase/1365249?utm_campaign=2&utm_medium=cp_9&utm_source=Linkedin&utm_content=ia&utm_term=semiconductor-passivation-glass&utm_id=free (Accessed on 05 January 2024).
4. Schott. [Online] Passivation Glass. Available at: https://www.schott.com/en-hr/products/passivation-glass-p1000287/technical-details (Accessed on 05 January 2024).
5. Zhong, C., et al. (2022). Properties and mechanism of amorphous lead aluminosilicate passivation layers used in semiconductor devices through molecular dynamic simulation. Ceramics International. doi.org/10.1016/j.ceramint.2022.07.191
6. Hansen, U., et al. (2009). Robust and Hermetic Borosilicate Glass Coatings by E-Beam Evaporation. Procedia Chemistry. doi.org/10.1016/j.proche.2009.07.019
7. Korvus Technology. [Online] The Revolution of PVD Systems in Thin Film Semiconductor Production. Available at: https://korvustech.com/thin-film-semiconductor/ (Accessed on 05 January 2024).
8. Schott. Technical Glasses: Physical and Technical Properties. Available at: https://www.schott.com/-/media/project/onex/shared/downloads/melting-and-hot-forming/390768-row-schott-technical-glasses-view-2020-04-14.pdf?rev=-1
9. Bonilla, R.S., et al. (2017). Dielectric surface passivation for silicon solar cells: A review. Physica Status Solidi. doi.org/10.1002/pssa.201700293
10. Babu, S.V., et al. (1993). Reliability of Multilayer Copper/Polyimide. Defense Technical Information Centre. Available at: https://apps.dtic.mil/sti/citations/ADA276228
11. Liao, B., et al. (2021). Unlocking the potential of boronsilicate glass passivation for industrial tunnel oxide passivated contact solar cells. Progress in Photovoltaics. doi.org/10.1002/pip.3519
12. Imamura, K., et al. (2018). Effective passivation for nanocrystalline Si layer/crystalline Si solar cells by use of phosphosilicate glass. Solar Energy. doi.org/10.1016/j.solener.2018.04.063

Sealing MEMS Devices with Glass

 

Krista Grayson

•

December 5, 2023

Micro-electromechanical systems (MEMS) have revolutionized various industries by integrating miniaturized mechanical and electrical components onto a single substrate, enabling the creation of highly sensitive and efficient devices. They are key elements in an array of medical, automotive, industrial, and defense applications.

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However, the success of MEMS devices often hinges on maintaining a hermetic environment to protect their delicate internal components. This is where glass frit sealing technology comes into play, providing a superior solution for achieving reliable hermetic seals in precise applications like MEMS manufacturing and packaging.²

Understanding Hermetic Sealing and its Importance

Hermetic sealing involves creating an airtight barrier around a device to prevent the entry of contaminants, moisture, and other external elements. This sealing technique is crucial for MEMS devices as even minute environmental influences can alter their performance or lead to premature failure. In applications where stability, precision, and reliability are paramount, such as in the aerospace, medical, and telecommunications industries, achieving a hermetic seal is essential.²

Glass Frit Sealing: The Ideal Solution for MEMS

Among the various methods available to achieve hermetic seals, glass frit sealing stands out as a versatile and high-yield approach, particularly suited for MEMS applications. This technique leverages the unique properties of glass to create a reliable, robust, and precise encapsulation for MEMS devices while imposing minimal stress on the bonding surface. In a three-step process, a glass paste is screen-printed on a capping wafer, which is then bonded to the subject device through thermocompression for 10 minutes. During this process, 1000 mBar of force and 440 °C are applied to the material under a vacuum. Capable of bonding both hydrophobic and hydrophilic surfaces, this technique can be applied to almost all commonly used microsystem surface materials, such as aluminum, silicon, and glass.^3,4

Tailoring Precision Using the Coefficient of Thermal Expansion (CTE)

As the name implies, glass frit sealing makes use of glass particles, known as frit, which can be precisely formulated to match the coefficient of thermal expansion (CTE) of different materials.⁴ The CTE of a material refers to how its dimensions change with temperature fluctuations. By tailoring the glass frit’s composition, its CTE can be adjusted to closely match that of the MEMS device and the encapsulating material. This compatibility ensures that, when subjected to temperature variations, the seal remains intact without compromising the structural integrity of the device.²

Mo-Sci, a pioneering glass technology company, has been at the forefront of developing and perfecting glass frit sealing solutions for various high-tech applications, including MEMS devices. Its expertise lies in creating sealing glasses with customizable thermal expansion coefficients. With a diverse range of glass-metal and glass-ceramic seals that are meticulously matched in terms of CTE and are capable of enduring temperatures as high as 1600°C, Mo-Sci is an ideal partner for MEMS manufacturers seeking reliable hermetic sealing solutions.^2,5

The Versatility of Glass Frit Sealing

The applications of glass frit sealing extend beyond MEMS devices and encompass a range of cutting-edge technologies:

1. Solar Cells

Sealing glasses find utility in encapsulating perovskite photovoltaic elements. These elements are promising alternatives to traditional silicon solar cells due to their high efficiency and lower production costs. However, perovskite cells are highly sensitive to moisture, whereby even small amounts can completely prevent function. Laser-assisted bonding of glass frit sealing guarantees a durable hermetic barrier, shielding perovskite cells from moisture exposure and locking in lead-containing chemicals.²

2. Metal Ion and Thermal Batteries

In the evolving landscape of energy storage solutions, glass frit sealing plays a pivotal role in enhancing the reliability and longevity of metal ion batteries, including lithium-ion and sodium-ion batteries. These batteries require seals that can withstand high temperatures and resist chemical corrosion. Sealing glasses provide a resilient barrier that enables the efficient operation of these advanced battery technologies.

Sealing glass is also a viable solution for molten salt batteries. These batteries are highly dependent on sodium salts, including sodium-nickel and sodium-sulfur chloride, to achieve remarkable energy and power densities. For this reason, they are an appealing option for large-scale industrial and energy storage applications.

Sealing glasses are classed as a high-energy alternative to conventional polymeric or metal seals as they exhibit excellent resilience against demanding chemical environments but also against the rigorous operating temperatures inherent to molten salt batteries, which can range from 300 °C to 350 °C.²

3. High Temperature Sensors

Glass frit sealing also finds applications in high-temperature environments, such as automotive systems and chemical processing plants. The predictable thermal expansion and corrosion-resistant nature of sealing glass ensure the longevity and stability of sensors operating in extreme conditions.²

4. Solid Oxide Fuel Cells (SOFCs)

SOFCs hold tremendous promise for clean and efficient power generation, but their high operating temperatures present engineering challenges. To create high-temperature sealant materials for SOFCs, Mo-Sci currently utilizes two methods. One relies on a traditional glass-ceramic seal, wherein the glass undergoes crystallization to establish bonds with the sealing components.

The second approach involves the development of viscous-compliant glass seals. These seals remain vitreous throughout application and can self-heal, mitigating the risks associated with thermal stresses and ensuring the long-term stability of SOFCs.This groundbreaking technology is anticipated to play a pivotal role in facilitating the commercialization of SOFCs and driving their widespread adoption.^2,6

Embracing the Future with Glass Frit Sealing

Glass frit sealing technology has emerged as a transformative solution for achieving hermetic seals in MEMS devices and a wide array of other advanced applications. By precisely engineering the properties of sealing glasses, companies like Mo-Sci enable manufacturers to create highly reliable and robust encapsulation systems.

As industries continue to push the boundaries of technological innovation, the role of glass frit sealing in safeguarding sensitive components and ensuring optimal device performance becomes increasingly vital.

References and Further Reading

1. Forbes. Why Timing Must Be Tough Enough For Our Digital World. Available at: https://www.forbes.com/sites/forbestechcouncil/2021/09/02/why-timing-must-be-tough-enough-for-our-digital-world/ (Accessed on 10 August 2023).
2. Mo-Sci. Sealing Glass Applications. Available at: https://mo-sci.com/sealing-glass-applications/ (Accessed on 10 August 2023).
3. Chang H-D, et al. (2010). High hermetic performance of glass frit for MEMS package. 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference. https://doi.org/10.1109/IMPACT.2010.5699539
4. Knechtel R. (2015). Chapter 31 – Glass Frit Bonding. Handbook of Silicon Based MEMS Materials and Technologies (Second Edition). https://doi.org/10.1016/B978-0-323-29965-7.00031-2
5. Mo-Sci. Matching Coefficient of Thermal Expansion in Glass Seals. Available at: https://mo-sci.com/matching-cte-in-glass-seals/ (Accessed 10 August 2023).
6. Mo-Sci. Sealing Glass. Available at: https://mo-sci.com/products/sealing-glass/ (Accessed on 10 August 2023).

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