% tin % lead % silver Melting range
20 80 183-275C 361-527F
30 70 183-255C 361-491F
40 60 183-234C 361-453F
50 50 183-212C 361-414F
60 40 183-188C 361-370F
63 37 183-183C 361-361F
62 36 2 179-189C 354-372F
45 54 1 177-210C 351-410F
This shows the solder compositions of lead and tin only have a solidification temperature of 183C. The proportions of the two metals alter the the melting point and at 63/37 the melting and solidification temperature are the same, making for excellent solder beads.
The addition of silver can reduce the solidification point but the melting point can vary significantly. Other solder alloys can make significant alterations in the melting and solidification temperatures.
revised 3.12.24
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