Lead free
solders have been created in response to concerns about lead, especially in the
electronics industry. The following tables present a selection of available
solder compositions. The characteristics
of these lead free solders can be compared to the common lead bearing solders
in the last table.
Abbreviations
for the metals of the compositions:
Ag=Silver;
Bi=Bismuth; Cu=Copper; Ge=Germanium; In=Indium;
Sb=Antimony; Sn=Tin;
Zn=Zinc
Melting Temperatures of Lead-Free
Solders
Alloy % Melting Temperature Comments
Range (ºC)
Sn 65, Ag 25 233
High strength; patented
by Motorola (“Alloy J”)
Sn 99.3, Cu
0.7 227 Eutectic
Sn 96.5, Ag
3.5 221
Eutectic.
Excellent strength and wetting
Sn 98, Ag 2 221 – 226
Sn 77.2, Ag 2.8,
In 20 175
– 186
Sn 95, Sb5 232 – 240 Good high-temperature shear strength
Sn 42, Bi 58 138 Well
established; expensive
Sn 91, Zn 9 199 Eutectic.
Corrodes easily; high dross
Sn 95.5, Ag 0.5,
Cu 4 217
– 350 Lead-free plumbing solder
Sn 97.25, Ag
2, Cu 0.75 217 – 219
Sn 91.8 Ag
3.2, Cu 0.5 217 – 218
Sn 95.5, Ag
3.8, Cu .07 217 – 220
Sn 95.5, Ag
4, Cu 0.5 217 – 225
Sn 95, Ag 4, Cu
1 217 – 220
Sn 94.6, Ag
4.7, Cu 1.7 217 – 244
Sn 89, Zn 8, Bi
3 192
– 197
Sn 97, Ag
0.2, Cu 2, Sb 0.8 287 – 318 High melting range; “Aquabond”
Sn 96.2, Ag
2.5, Cu 0.8, Sb 0.5 217 – 225
Sn 90.5, Ag
2, Bi 7.5 190 – 216
Sn-91.8, Ag
3.4, Bi 4.8 201 – 205
Sn 93.5, Ag
3.5, Bi 3 208 – 217
Sn 94.25, Ag
2, Bi 3, Cu 0.75 205 – 217
Sn90.7,
Ag3.5, Bi 5, Cu 0.7 198 – 213
Sn 93.4, Ag
2, Bi 4, Cu 0.5, Ge 0.1 202 – 217
Sn 42.9, Bi
57, Ag 0.1 138 – 140
Sn 48, In 52 118 Eutectic. Lowest melting point. Expensive
Source:
Liquidus Temperatures (°C) of
Candidate Lead-Free Solder Alloys for Replacing Eutectic Tin-Lead Solder
Alloy
Composition% Liquidus Melting Range
98Sn-2Ag 221-226
96.5Sn-3.5Ag 221 221
99.3Sn-0.7Cu 227 227
96.3Sn-3.2Ag-0.5Cu
218 217-218
95.5Sn-3.8Ag-0.7Cu 210 217-210
95.5Sn-4.0Ag-0.5Cu
217-219
95Sn-5Sb 232-240
42Sn-58Bi 138 138
89Sn-3Bi-8Zn 189-199
Where there
is a single temperature in the melting range column, the solder is eutectic.
Based on:
V. Solberg,
“No-Lead Solder for CSP: The Impact of Higher Temperature SMT Assembly
Processing,” Proc. NEPCON West 2000 Conf. (Feb. 28 - Mar. 2, 2000) Anaheim, CA
(Source: Indium Corp.) # N.-C. Lee, “Lead-Free Chip-Scale Soldering of
Packages,” Chip Scale Review, March-April 2000.
Source:
Solidus and Liquidus Temperatures of
Some Leadfree Alloys on Copper
Alloy % Solidus
(°C) Liquidus (°C)
98Sn-1Ag-1Sb 222 232
89Sn-4Ag-7Sb 230 230
91.2Sn-2Ag-0.8Cu-6Zn
217 217
89.2Sn-2Ag-0.8Cu-8Zn
215 215
89.2Sn-10Bi-0.8Cu
185
217
85Sn-10Bi-5Sb
193 232
52Sn-45Bi-3Sb
145 178
42Sn-58Bi 138 138
Based on:
M.E. Loomans,
S. Vaynman, G.Ghosh and M.E. Fine, “Investigation of Multi-component Lead-free
Solders,” J. Elect. Matls. 23(8), 741 (1994)
Source:
Eutectic Composition of Solders
Most solders
and especially tin-lead alloys have a melting (or pasty) range between which
the metal has moved from a proper solid (solidus) to a completely liquid
(liquidus) state. Wide melting ranges
are ideal for plumbers, they are not for electronics, or stained glass. It is much easier to run a nice bead with a
narrow range of melting (pasty) temperatures.
Some alloys
of solder have what is known as an eutectic characteristic. This is where the liquidus and solidus states
occur at the same temperature. A
composition of 61.9% tin and 38.1% lead is both eutectic and the melting
occurs at a minimum temperature.
For
comparison with lead free solder characteristics the following % compositions
of Tin (Sn), Lead (Pb) and Silver (Ag) solders are given.
Element % of
solders Melting point Comment
Sn 62, Pb 36,
Ag 2 179 Eutectic; traces of antimony
Sn 63, Pb 37 183 Eutectic; traces of antimony
Sn 60, Pb 40 183-191 Traces of antimony
Sn 96.3, Ag
3.7 221 High melting point. Eutectic
Sn 10, Pb 90 275-302
Sn 3, Pb 97 275-320
Sn 5, Pb
93.5, Ag 1.5 296-301
Source:
http://en.wikipedia.org/wiki/Solder#Lead-free_solder
Conclusions
Most of the
alternative solders contain tin as it assists in the formation of bonds with a
wide variety of metals. These solders
are also mechanically weaker than tin-lead solders. Lastly, they are much more expensive than
tin-lead solders. Even within the
tin-lead solders there is a variation in price, as tin is much more expensive
than lead. If high temperatures were not a problem, you could use a high lead
content solder. However, that also
raises the liquidus temperature and increases the pasty range.
The choice in
lead free solders is between the high liquidus temperatures of the less
expensive compositions and the high price of the eutectic, or nearly so,
ones. The lowest eutectic composition is
the Tin-Bismuth solder, but it is also among the most expensive to buy. You should also note that the inclusion of
copper in the composition prolongs the life of the solder bit, as low lead
content of the solder leads to the incorporation of small amounts of copper
from the tip into the solder joint.