The surface tarnishes that form on metal are generally not soluble in (and cannot be removed by) most conventional cleaning solvents. They must, therefore be acted upon chemically [or mechanically] in order to be removed. The required chemical reaction is most often accomplished by the use of soldering fluxes. These soldering fluxes will displace the atmospheric gas layer on the metal’s surface and upon heating will chemically react to remove the tarnish layer from the fluxed metals and maintain the clean metal surface throughout the soldering process.
The chemical reaction that is required will usually be one of two basic types. It can be a reaction where the tarnish and flux combine forming a third compound that is soluble in either the flux or its carrier.
An example of this type of reaction takes place between water-white rosin and copper oxides. Water-white rosin, when used as a flux is usually in an isopropyl alcohol carrier and consists mainly of abietic acid and other isomeric diterpene acids that are soluble in several organic solvents. When applied to an oxidized copper surface and heated, the copper oxides will combine with the abietic acid forming a copper abiet (which mixes easily with the un-reacted rosin) leaving a clean metallic surface for solder wetting. The hot molten solder displaces the rosin flux and the copper abiet, which can then be removed by conventional cleaning methods.
Another type of reaction is one that causes the tarnish film, or oxidized layer to return to its original metallic state restoring the metals clean surface.
An example of this type of reaction takes place when soldering under a blanket of heated hydrogen. At elevated temperatures (the temperature that is required for the intended reaction to take place is unique to each type of base metal) the hydrogen removes the oxides from the surface, forming water and restoring the metallic surface, which the solder will then wet. There are several other variations and combinations that are based on these two types of reactions.
|Acids commonly in fluxes|
Flux as a temporary protective coating
Once the desired chemical reaction has taken place (lifting or dissolving the tarnish layer) the fluxing agent must provide a protective coating on the cleaned metal surface until it is displaced by the molten solder. This is due to the elevated temperatures required for soldering causing the increased likelihood that the metal’s surface may rapidly re-oxidize if not properly coated. Any compound that can be used to create one of the required types of chemical reactions, under the operating conditions necessary for soldering, might be considered for use as a fluxing material. However, most organic and inorganic compounds will not hold up under the high temperature conditions that are required for proper soldering. That is why one of the more important considerations is a compound's thermal stability, or its ability to withstand the high temperatures that are required for soldering without burning, breaking down, or evaporating.
When evaluating all of the requirements necessary for a compound to be considered as a fluxing agent, it is important to consider the various soldering methods, techniques and processes available and the wide range of materials and temperatures they may require. A certain flux may perform well on a specific surface using one method of soldering and yet not be at all suitable for that same surface using a different soldering method. When in doubt it never hurts to check with the flux, or solder manufacturer for recommendations.
Courtesy of American Beauty Tools
Flux, an introduction
Fluxes, a description
The Purpose of flux
The action of fluxes